JUMP REPORT
| Avg Daily Volume: 20,848,800 Market Cap: 227.52B Sector: Technology Short Interest: 1.26 |
EARNINGS EXPECTATIONS:
THIS QTR: EPS: 1.24/share REV: 18,080/M
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LAST QTR: EPS: -.36/share ACTUAL: -1.12/share (MISS)
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NEXT QTR: EPS: 1,21/share REV: 18,820/M
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FULL YR: EPS: 4.39/share REV: 69,400/M
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*These are the base metrics we will be watching against the actual release numbers
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BEAT/MISS RECORD: 66% OF THE TIME THEY BEAT ESTIMATES
PRIOR ‘JUMP ZONE’ MOVES (LAST 3 QTRS %) 2.56, -10.57, -8.05
EXPECTED JUMP MOVE: 8-10%
Links To Latest News and Headlines
Intel Corp. shares declined steadily in the extended session Monday, handing back daily gains, after the chip maker revealed its “road map” and repackaging plans for its future products.
Intel Corp said on Monday its factories will start building Qualcomm Inc chips and laid out a roadmap to expand its new foundry business to catch rivals such as Taiwan Semiconductor Manufacturing Co and Samsung Electronics Co Ltd by 2025. Amazon.com Inc will be another new customer for the foundry chip business, said Intel, which for decades held the lead in technology for manufacturing the smallest, fastest computing chips. But Intel has lost that lead to TSMC and Samsung, whose manufacturing services have helped Intel’s rivals Advanced Micro Devices Inc and Nvidia Corp produce chips that outperform Intel’s. AMD and Nvidia design chips which then are made by the rival chip manufacturers, called foundries.
(Bloomberg) — Intel Corp., playing catch-up in semiconductor technology after losing its long-held dominance, vowed to become the industry leader again in 2025 by rethinking some of the fundamentals of how chips are made, and signed up rival Qualcomm Inc. as a manufacturing customer.Santa Clara, California-based Intel aims to step up innovation and is changing the approach used to measure progress in chip production, arguing that the current system gives competitors Taiwan Semiconductor Manufac
In the past, chipmakers like Intel Corp and Taiwan Semiconductor Manufacturing Co raced each other to make the features on chips smaller and smaller to cram more computing power onto a single chip. But the newest race in chipmaking is to stack “chiplets” or “tiles” – tiny squares sliced out of what would normally be a single, larger chip – on top of a base layer of silicon in one package, mixing and matching different technologies rather than trying to make a single big chip. It also could help manufacturers improve chip performance even as they push the physical limits of how small chip features can get.
(Reuters) -Intel Corp said on Monday its factories will start building Qualcomm Inc chips and laid out a roadmap to expand its new foundry business to catch rivals such as Taiwan Semiconductor Manufacturing Co and Samsung Electronics Co Ltd by 2025. Amazon.com Inc will be another new customer for the foundry chip business, said Intel, which for decades held the lead in technology for manufacturing the smallest, fastest computing chips. But Intel has lost that lead to TSMC and Samsung, whose manufacturing services have helped Intel’s rivals Advanced Micro Devices Inc and Nvidia Corp produce chips that outperform Intel’s. AMD and Nvidia design chips which then are made by the rival chip manufacturers, called foundries.
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